MG Chemicals 9300 Epoxy Adhesive, Heat Cure, Low Tg

Description

Key Features:
– One-part adhesive, no mixing required
– Heat cured for low stress bonding of SMD’s and fiber optic components
– Designed for electronic assembly operations
– Excellent adhesion to common electronic substrates and components
– Unlimited working time at room temperature
– Tg of 22 °c [72 °f]

Technical Specifications:
– Cure time: 1 hour @ 70 °c [158 °f]
– Package Dimensions: 10.3 x 3.8 x 2.2 inches; 12.35 ounces
– Item model number: 9300-300ML
– Date First Available: January 25, 2018
– Manufacturer: MG Chemicals
– ASIN: B07999DBFC
– Country of Origin: Canada

Other Information:
– Applications include bonding passive components to a PCB, reinforcing wire bonds, and staking SMD’s to a PCB for extra support
– Can be used in manual, pneumatic, and robotic dispensing processes
– Suitable for use in consumer electronics, contract manufacturing, telecommunications, medical equipment, and automotive manufacturing industries.